Title:
半導体装置
Document Type and Number:
Japanese Patent JP6577558
Kind Code:
B2
Inventors:
Hikasa Asahi
Application Number:
JP2017237935A
Publication Date:
September 18, 2019
Filing Date:
December 12, 2017
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L29/739; H01L21/336; H01L29/78
Domestic Patent References:
| JP2012151470A | ||||
| JP2009054903A | ||||
| JP2012156564A | ||||
| JP2004111772A |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office