Title:
半導体デバイスの評価条件設定方法、及び評価条件設定装置
Document Type and Number:
Japanese Patent JP6581835
Kind Code:
B2
Abstract:
An object of the present invention is to provide an evaluation condition setting method and an evaluation condition setting apparatus of a semiconductor device which can select an appropriate evaluation pattern for exposure condition management with high accuracy. In order to solve the object, the present invention proposes an evaluation condition setting method or an evaluation condition setting apparatus which excludes a pattern corresponding to a process window chart defining a process window range smaller than a predetermined process window range from a measurement target, in a plurality of the process window charts which are obtained based on scanning of a charged particle beam with respect to another pattern formed on a sample.
Inventors:
Hiroyuki Shindo
Iku Fukaya
Iku Fukaya
Application Number:
JP2015151452A
Publication Date:
September 25, 2019
Filing Date:
July 31, 2015
Export Citation:
Assignee:
Hitachi High-Technologies Corporation
International Classes:
H01L21/66; G03F7/20
Domestic Patent References:
| JP2004079911A | ||||
| JP2003257838A |
Foreign References:
| WO2014129307A1 | ||||
| US20070050749 |
Attorney, Agent or Firm:
Shigemi Iwasaki