Title:
防音構造
Document Type and Number:
Japanese Patent JP6585314
Kind Code:
B2
Abstract:
The present invention provides a small sound proof structure exhibiting high sound proof performance for lower-frequency sounds. The sound proof structure includes at least one sound proof cell having a frame with a hole and a film secured to the frame, the film having a surface density distribution. A parameter X represented by the following formula (1) satisfies the following inequality (2): X = Eh2 / (ρmax / ρmin) [N] … (1) (Δd / L − 0.025) / (0.06) [N] ≤ X [N] ≤ 10 [N] … (2) Where Δd represents the length of the shortest line segment between high surface density regions and between a high surface density region and the end of the hole, L [m] represents the length of the longest line segment between the ends of the hole, E [Gpa] represents the Young's modulus of the material in a low surface density region, h [m] represents an average film thickness in the low surface density region, and ρmax and ρmin represent the maximum surface density and the minimum surface density of the film respectively.
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Inventors:
Akihiko Otsu
Shogo Yamazoe
Shinya Shirata
Mihiro Sugawara
Shogo Yamazoe
Shinya Shirata
Mihiro Sugawara
Application Number:
JP2018568066A
Publication Date:
October 02, 2019
Filing Date:
January 24, 2018
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G10K11/16; G10K11/172
Domestic Patent References:
| JP201026257A | ||||
| JP2016161720A |
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mitsuhashi
Fumio Mitsuhashi