Title:
ウェーハ‐ハンドリング・エンドエフェクタ
Document Type and Number:
Japanese Patent JP6595663
Kind Code:
B2
Abstract:
Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.
Inventors:
Lobby Ingram-Gobble
Michael e simmons
Philip Wolf
Ryan Garrison
Christopher storm
Michael e simmons
Philip Wolf
Ryan Garrison
Christopher storm
Application Number:
JP2018107770A
Publication Date:
October 23, 2019
Filing Date:
June 05, 2018
Export Citation:
Assignee:
Form Factor Beaverton, Inc.
International Classes:
H01L21/677; B25J15/08
Domestic Patent References:
| JP64005752A | ||||
| JP2009158902A | ||||
| JP2000133694A | ||||
| JP2002346965A | ||||
| JP8107136A | ||||
| JP11026554A |
Foreign References:
| US6942265 |
Attorney, Agent or Firm:
Kenji Sugimura