Title:
成膜装置
Document Type and Number:
Japanese Patent JP6602495
Kind Code:
B2
Abstract:
A film formation apparatus of the present invention is a film formation apparatus which performs deposition on a substrate to be processed, and includes a supply device that is disposed in an evacuable vacuum chamber and supplies a deposition material, and a holding device that holds the substrate to be processed during deposition. The holding device includes a deposition preventing plate that covers a region to which the deposition material is adhered in the holding device, a holder that holds the substrate to be processed, and a position setter that sets a position of the substrate to be processed when the deposition preventing plate and the holder sandwich and hold the substrate to be processed. The position setter includes a roller that comes into contact with a peripheral edge end surface portion of the substrate to be processed.
Inventors:
Toshinori Kaneko
Tetsuhiro Ohno
Tetsuhiro Ohno
Application Number:
JP2018560688A
Publication Date:
November 06, 2019
Filing Date:
June 28, 2018
Export Citation:
Assignee:
ULVAC, Inc.
International Classes:
C23C14/50; H01L21/683
Domestic Patent References:
| JP2000336476A | ||||
| JP6252245A | ||||
| JP2005077845A | ||||
| JP11145082A | ||||
| JP2006086238A | ||||
| JP11021667A |
Attorney, Agent or Firm:
Shu Oikawa
Tomoo Katsumata
Ryo Tsuchiya
Tomoo Katsumata
Ryo Tsuchiya