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Patent Searching and Data


Title:
イヤホンへのセンサの統合
Document Type and Number:
Japanese Patent JP6609035
Kind Code:
B2
Abstract:
An in-ear earphone includes a body shaped to fit in the wearer's ear, a nozzle extending from the body towards the ear canal of the wearer's ear, the nozzle including an acoustic passage to conduct sound waves to the ear canal of the wearer, an ear canal sealing structure extending from the nozzle, and a sensor coupled to the nozzle. The sealing structure includes a thin sheet of material forming a hollow shape surrounding the nozzle and sensor, and the body, nozzle, sealing structure, and sensor are arranged such that when the earphone is located in the wearer's ear, the sensor faces the tragus of the ear, and the sealing structure simultaneously forms an acoustic seal to the entrance to the ear canal and provides optical coupling between the sensor and the tragus with minimal air gaps between the sensor, the sealing structure, and the tragus.

Inventors:
Hirsch Anilkanto Mancordy
Kyle DeCuberis
Marco Oleskanin
Michael di tin
Jonathan Di Turner
Application Number:
JP2018504220A
Publication Date:
November 20, 2019
Filing Date:
July 28, 2016
Export Citation:
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Assignee:
BOSE CORPORATION
International Classes:
H04R1/10; A61B5/0245
Domestic Patent References:
JP2012518515A
JP2008229355A
JP2003070751A
JP2007130356A
JP2013118904A
JP2009153824A
JP2008302260A
JP2009500060A
JP2015521424A
Foreign References:
WO2013014852A1
WO2009001449A1
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mitsuhiro
Tatsuhiko Abe