Title:
音叉型振動片の製造方法、振動デバイス、電子機器、および移動体
Document Type and Number:
Japanese Patent JP6620516
Kind Code:
B2
Abstract:
An electronic component manufacturing method, in which a notch and a concave portion are formed in a substrate, includes forming an etching mask in which a maximum width of a first mask portion which forms a width between two side surfaces of the concave portion along a longitudinal direction, when the substrate is seen in a plan view from a direction perpendicular to a surface of the substrate having the concave portion formed therein, is smaller than a width of a second mask portion which forms a minimum width of an opening of the notch, and forming the notch and the concave portion by performing dry etching processing on the substrate.
Inventors:
Atsushi Matsuo
Takayuki Kikuchi
Takayuki Kikuchi
Application Number:
JP2015211600A
Publication Date:
December 18, 2019
Filing Date:
October 28, 2015
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H03H3/02; H01L41/113; H01L41/332; H03B5/32; H03H9/19
Domestic Patent References:
| JP2007166242A | ||||
| JP2013229733A | ||||
| JP2014107603A | ||||
| JP2014165910A | ||||
| JP2011166325A | ||||
| JP2011199330A | ||||
| JP2010010734A | ||||
| JP2007013382A | ||||
| JP2009027711A |
Attorney, Agent or Firm:
Kazuaki Watanabe
Mitsuhiro Isobe
Satoshi Nakai
Hiroki Matsuoka
Mitsuhiro Isobe
Satoshi Nakai
Hiroki Matsuoka