Title:
蓋部を用いる電気的デバイスの搭載方法、および、当該方法における使用に適した蓋部
Document Type and Number:
Japanese Patent JP6629290
Kind Code:
B2
Abstract:
A method for mounting an electrical component on a substrate is disclosed. According to the method, joining is simplified using a cover, or hood, that includes a contact structure on an inner side of the hood, wherein when the hood is mounted, the contact structure is joined to the underlying structure at different joining levels simultaneously using an additional material. Moreover, a joining pressure, e.g., for diffusion or sintered bonds for electrical contacts, can be applied using such a hood.
More Like This:
| JPS55140248 | METHOD OF PACKAGING SEMICONDUCTOR DEVICE |
Inventors:
Nora Bushe
Yeak Strogies
Claus Wilke
Yeak Strogies
Claus Wilke
Application Number:
JP2017503064A
Publication Date:
January 15, 2020
Filing Date:
March 30, 2015
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
H01L23/48; H01L21/60; H01L23/02; H01L23/12
Domestic Patent References:
| JP2003031724A | ||||
| JP2014017485A | ||||
| JP2014011236A |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima