Title:
同軸または三軸シール組立体
Document Type and Number:
Japanese Patent JP6629293
Kind Code:
B2
Abstract:
An arrangement for connecting a sensor assembly and a cable assembly. The arrangement includes a signal wire. The arrangement includes a transversely-extending insulating barrier. The signal wire extends through the insulating barrier. The arrangement includes a shield wire that is configured to provide at least part of a grounding pathway. The shield wire extends through the insulating barrier at a location spaced from the signal wire. The arrangement includes at least one conductive layer that is located upon the insulating barrier. The at least one conductive layer is spaced away from the signal wire and is in electrical contact with the shield wire. At least a portion of the insulating barrier has a non-linear profile. At least a portion of the at least one conductive layer that is located upon the at least a portion of the insulating barrier has the non-linear profile.
Inventors:
Rustig, James Michael
Application Number:
JP2017505084A
Publication Date:
January 15, 2020
Filing Date:
July 01, 2015
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
H02G3/22; H01B7/00; H01B7/18; H01B7/285
Domestic Patent References:
| JP2014511134A | ||||
| JP62075390A | ||||
| JP11299057A | ||||
| JP2004045380A |
Attorney, Agent or Firm:
Sakamoto & Partners, Inc.
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka