Title:
半導体装置
Document Type and Number:
Japanese Patent JP6630390
Kind Code:
B2
Abstract:
A semiconductor device includes: a semiconductor element; an element conductor having an element mounting surface on which the semiconductor element is mounted; a connection conductor that is arranged apart from the element conductor and has a connection surface on an upper part thereof; a connecting line connecting the semiconductor element and the connection surface of the connection conductor; and an encapsulation resin that encapsulates the semiconductor element, the element conductor, the connection conductor, and the connecting line, wherein: a parasitic capacitance reducing structure is provided in at least one of facing side surfaces of the element conductor and of the connection conductor, the facing side surfaces being arranged to face each other.
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Inventors:
Katsuhiro Takao
Application Number:
JP2018064569A
Publication Date:
January 15, 2020
Filing Date:
March 29, 2018
Export Citation:
Assignee:
Aoi Electronics Co., Ltd.
International Classes:
H01L23/12; H01L23/50
Domestic Patent References:
| JP11330313A | ||||
| JP2013183055A | ||||
| JP4097549A | ||||
| JP2008103550A | ||||
| JP2012235172A | ||||
| JP2005217452A |
Foreign References:
| WO2001003184A1 |
Attorney, Agent or Firm:
Fuyuki Nagai
Keiichi Ikeda
Keiichi Ikeda