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Title:
密着層形成組成物、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、インプリント用モールドの製造方法、およびデバイス部品
Document Type and Number:
Japanese Patent JP6632340
Kind Code:
B2
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Inventors:
Takeshi Honma
Toshiki Ito
Satoshi Otani
Application Number:
JP2015221384A
Publication Date:
January 22, 2020
Filing Date:
November 11, 2015
Export Citation:
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Assignee:
Canon Inc
International Classes:
H01L21/027; B29C33/38; B29C59/02; B81C99/00; C08G75/04
Domestic Patent References:
JP2013153084A
JP2013202982A
JP2012079782A
JP2010525577A
Foreign References:
WO2011155602A1
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa