Title:
表面処理銅箔
Document Type and Number:
Japanese Patent JP6632739
Kind Code:
B2
Abstract:
The purpose of the present invention is to eliminate adhesion defects caused by press joining of a copper foil with a resin, the copper foil subjected to a silane coupling treatment with an olefin-based silane coupling agent on a roughened surface of the copper foil. In this surface-treated copper foil, the surface roughness Rz of the surface on the roughened layer side is no more than 1.10 μm when measured with a contact-type roughness tester, the minimum auto-correlated length Sal of the surface on the roughened layer side is 0.20 μm to 0.85 μm inclusive, and the interface developed area ratio (Sdr) of the surface on the roughened layer side is in a range of 20-300%.
More Like This:
| WO/2021/220524 | COMPOSITE COPPER MEMBER |
| JPH1036991 | PRODUCTION OF ELECTROLYTIC COPPER FOIL |
Inventors:
Takahiro Tsuruta
Takeo Uno
Yuko Okuno
Takeo Uno
Yuko Okuno
Application Number:
JP2018545261A
Publication Date:
January 22, 2020
Filing Date:
April 18, 2018
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C25D7/06; B32B15/08; C23C28/00; C25D5/16; C25D5/48; H05K3/38
Domestic Patent References:
| JP2003201585A | ||||
| JP2015013474A | ||||
| JP2015105421A | ||||
| JP4927963B2 | ||||
| JP2011216598A | ||||
| JP2005190945A | ||||
| JP2013155415A | ||||
| JP8309918A |
Foreign References:
| WO2014081041A1 | ||||
| WO2016174998A1 | ||||
| WO2016117498A1 |
Attorney, Agent or Firm:
Hide Tanaka Tetsu
Yuki Yamada
Tetsuya Mori
Yuki Yamada
Tetsuya Mori