Title:
熱成形可能なポリマー厚膜透明導体および容量性スイッチ回路におけるその使用
Document Type and Number:
Japanese Patent JP6636938
Kind Code:
B2
Abstract:
This invention is directed to a polymer thick film transparent conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to a injection molding process.
Inventors:
Jay Robert Dorfman
Application Number:
JP2016555471A
Publication Date:
January 29, 2020
Filing Date:
March 17, 2015
Export Citation:
Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
H01B5/14; C08K3/22; C08L71/08; C08L75/04
Domestic Patent References:
| JP2011192401A | ||||
| JP9063754A | ||||
| JP2007141521A | ||||
| JP11242912A |
Foreign References:
| WO2013043619A1 | ||||
| US20140037941 | ||||
| WO2011105185A1 |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office