Title:
基板加熱装置及び基板加熱方法
Document Type and Number:
Japanese Patent JP6639867
Kind Code:
B2
Abstract:
The invention relates to a substrate heating device and a substrate heating method and aims to shorten tact time required for heating a substrate. A substrate heating device includes: a decompression part capable of decompressing a substrate to which a solution is applied to form a polyimide; a first heating part capable of heating the substrate at a first temperature; and a second heating part capable of heating the substrate at a second temperature that is higher than the first temperature, where the second heating part is installed independently from the first heating part.
Inventors:
Shigeru Kato
Kenichi Yamatani
Yoshiaki Masu
Kenichi Yamatani
Yoshiaki Masu
Application Number:
JP2015215013A
Publication Date:
February 05, 2020
Filing Date:
October 30, 2015
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
F26B3/28; F26B13/02; F26B13/10; F26B23/04
Domestic Patent References:
| JP2006210496A | ||||
| JP2013202431A | ||||
| JP2006194546A | ||||
| JP11223462A | ||||
| JP2010215324A |
Foreign References:
| WO2014077253A1 |
Attorney, Agent or Firm:
Sumio Tanai
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida
Masatake Shiga
Matsumoto
Ryu Miyamoto
Masato Iida