Title:
モジュール化液体冷却式サーバーシャーシ
Document Type and Number:
Japanese Patent JP6650496
Kind Code:
B2
Abstract:
The present application relates to a liquid-cooled server chassis including: a case; one or more liquid-cooling modules, each liquid-cooling module including a housing, a gas outlet valve, and a liquid return valve, wherein the gas outlet valve and the liquid return valve are opened in an operation of the liquid-cooling module, and the liquid-cooling module accommodates a single server and is filled with coolant during operation; a connector configured to connect the liquid-cooling module to a power source; and a circulation portion including an gas outlet pipe, a liquid return pipe, a vapour processing part, and a liquid collecting part. The server can be taken out separately for maintenance or replacement without affecting the operation of other servers. In addition, a condenser is disposed outside the liquid-cooling module so that the coolant cannot contaminate the server and the reliability of the chassis is improved.
Inventors:
Gin and tango
Sun, Xiaogang
Chang, Binhwa
Sun, Xiaogang
Chang, Binhwa
Application Number:
JP2018146365A
Publication Date:
February 19, 2020
Filing Date:
August 03, 2018
Export Citation:
Assignee:
Beijing Baidu Netcom Science and Technology Company Limited
International Classes:
H05K7/20; G06F1/20
Foreign References:
| US20170325355 | ||||
| US20170064862 | ||||
| WO2016088280A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toyotaka Abe
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toyotaka Abe