Title:
伝熱部材及び伝熱部材の製造方法
Document Type and Number:
Japanese Patent JP6657924
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat transfer component that has a low thermal resistance and can suppress cracks from occurring even during hot/cold cycle loading and a manufacturing method of the heat transfer component.SOLUTION: A heat transfer component includes a substrate and a heat transfer layer 11 formed on at least a part of the surface, in which the heat transfer layer 11 includes core/shell particles 20 having a core/shell structure containing a core 21 made of a high polymer material having the elastic modulus of 5 GPa or smaller and a shell 22 made of at least one layer of metal layer covering a circumference of the core 21, and a binder 13 holding the core/shell particles 20.SELECTED DRAWING: Figure 1
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Inventors:
Shiro Ishikawa
Mountain Saki Kazuhiko
Hiroto Akaike
Mountain Saki Kazuhiko
Hiroto Akaike
Application Number:
JP2015250050A
Publication Date:
March 04, 2020
Filing Date:
December 22, 2015
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
B32B5/16; B32B7/027; B32B9/00; B32B27/20; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
| JP5497183B2 | ||||
| JP2012012425A |
Foreign References:
| WO2015151136A1 | ||||
| WO2012023566A1 |
Other References:
ミクロパールAU製品情報,日本,積水化学工業株式会社,2019年 5月20日,商品説明
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Masatake Shiga
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Masatake Shiga