Title:
配線基板
Document Type and Number:
Japanese Patent JP6669547
Kind Code:
B2
Abstract:
A wiring board of the present disclosure includes a core substrate, insulating layers, signal wiring conductors, ground wiring conductors, power-supply wiring conductors, a first mounting portion on which a first semiconductor device is to be mounted, a second mounting portion on which a second semiconductor device is to be mounted, many first-semiconductor-device connection pads connectable to signal electrodes of the first semiconductor device, many second-semiconductor-device connection pads connectable to signal electrodes of the second semiconductor device, and many signal connection conductors that connect the first-semiconductor-device connection pads to the second-semiconductor-device connection pads. The signal connection conductors include signal connection conductors of a first wiring group that extend only through a region above the top surface of the core substrate, and signal connection conductors of a second wiring group that extend through a region below the bottom surface of the core substrate.
Inventors:
Takayuki Taguchi
Application Number:
JP2016058263A
Publication Date:
March 18, 2020
Filing Date:
March 23, 2016
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/12; H05K3/46
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