Title:
ＬＥＤモジュール
Document Type and Number:
Japanese Patent JP6673410
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an LED module achieving a wide light distribution and a high efficiency.SOLUTION: An LED module comprises a mounting board and a plurality of LED devices arranged adjacent to one another on the mounting board. Each of the plurality of LED devices includes a first LED device and a second LED device each of which includes a light emitting diode element, a reflective member disposed lateral to the light emitting diode element, and a light transmissive member disposed above the light emitting diode element. In the first LED device, all lateral faces are adjacent to other LED devices, all lateral faces of the light transmissive member have a reflective member thereon, and an upper face serves as a light extraction face. The second LED device includes a lateral face adjacent to other LED devices and a lateral face not adjacent to other LED devices. In the second LED device, all lateral faces adjacent to the other LED devices among lateral faces of the light transmissive member have a reflective member thereon, while a lateral face not adjacent to the other LED device serves as a light extraction face, and an upper face serves as a light extraction face.SELECTED DRAWING: Figure 1
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Inventors:
Miyoshi Tomoki
Application Number:
JP2018144768A
Publication Date:
March 25, 2020
Filing Date:
August 01, 2018
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/60
Domestic Patent References:
| JP2011114096A | ||||
| JP2016115729A | ||||
| JP2011249346A | ||||
| JP2013182857A | ||||
| JP2015022859A | ||||
| JP2014143246A | ||||
| JP6380590B2 |
Foreign References:
| WO2014091914A1 | ||||
| US20140003044 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation