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Patent Searching and Data


Title:
半導体受光部品
Document Type and Number:
Japanese Patent JP6674428
Kind Code:
B2
Abstract:
To provide a semiconductor light receiving component capable of improving the high frequency property of a receiver device while maintaining the quality of the waveform output from a transimpedance amplifier (TIA) when operating in connection to the TIA.SOLUTION: The semiconductor light receiving component comprises: a photodiode 101; a signal extraction pad 103 to which a wiring for taking out an output signal from the photodiode 101 and inputting the same to an external element is connected; and a resistive element 102 one end of which is connected to the anode of the photodiode 101 and the other end of which is connected to the signal extraction pad 103, which are monolithically integrated on the same semiconductor substrate.SELECTED DRAWING: Figure 1

Inventors:
大野 哲一郎
相馬 俊一
倉田 優生
綱島 聡
田野辺 博正
Application Number:
JP2017194578A
Publication Date:
April 01, 2020
Filing Date:
October 04, 2017
Export Citation:
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Assignee:
日本電信電話株式会社
International Classes:
H01L31/10; H01L21/822; H01L27/04
Domestic Patent References:
JP2015172618A
JP2003508778A
JP2016192551A
JP2016039440A
JP2013135210A
JP2003134051A
JP2007053194A
JP2002076792A
JP2000124748A
JP2004119885A
Foreign References:
US20170264077
Attorney, Agent or Firm:
特許業務法人 谷・阿部特許事務所