Title:
半導体受光部品
Document Type and Number:
Japanese Patent JP6674428
Kind Code:
B2
Abstract:
To provide a semiconductor light receiving component capable of improving the high frequency property of a receiver device while maintaining the quality of the waveform output from a transimpedance amplifier (TIA) when operating in connection to the TIA.SOLUTION: The semiconductor light receiving component comprises: a photodiode 101; a signal extraction pad 103 to which a wiring for taking out an output signal from the photodiode 101 and inputting the same to an external element is connected; and a resistive element 102 one end of which is connected to the anode of the photodiode 101 and the other end of which is connected to the signal extraction pad 103, which are monolithically integrated on the same semiconductor substrate.SELECTED DRAWING: Figure 1
Inventors:
Tetsuichiro Ohno
Shunichi Soma
Kurata Yusei
Satoshi Tsunashima
Hiromasa Tanobe
Shunichi Soma
Kurata Yusei
Satoshi Tsunashima
Hiromasa Tanobe
Application Number:
JP2017194578A
Publication Date:
April 01, 2020
Filing Date:
October 04, 2017
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
H01L31/10; H01L21/822; H01L27/04
Domestic Patent References:
| JP2015172618A | ||||
| JP2003508778A | ||||
| JP2016192551A | ||||
| JP2016039440A | ||||
| JP2013135210A | ||||
| JP2003134051A | ||||
| JP2007053194A | ||||
| JP2002076792A | ||||
| JP2000124748A | ||||
| JP2004119885A |
Foreign References:
| US20170264077 |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office