Title:
赤外線センサ
Document Type and Number:
Japanese Patent JP6677925
Kind Code:
B2
Abstract:
To provide an infrared sensor that allows heat to be efficiently transferred from an insulating film to a heat sensitive element and has a good responsivity. The infrared sensor according to the present invention includes an insulating film 2; a pair of first adhesive electrodes 3A that is patterned on either surface of the insulating film; a pair of first terminal electrodes 4A that is patterned on either surface of the insulating film; a first heat sensitive element 5A that is provided on either surface of the insulating film and is connected to the pair of first adhesive electrodes; a pair of first pattern wiring parts 6A that is patterned on either surface of the insulating film with one end thereof being connected to the pair of first adhesive electrodes and the other end thereof being connected to the pair of first terminal electrodes; and a heat transfer film 7 that is connected to the first adhesive electrode besides the first pattern wiring part and is patterned on either surface of the insulating film in the vicinity of the first adhesive electrode using a thin film having a higher thermal conductivity than that of the insulating film.
Inventors:
Kenji Nakamura
Kazuyoshi Tari
Shingo Hirano
Kazuyoshi Tari
Shingo Hirano
Application Number:
JP2016016512A
Publication Date:
April 08, 2020
Filing Date:
January 29, 2016
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
G01J1/02; G01J5/02
Domestic Patent References:
| JP2013156235A | ||||
| JP2013050365A | ||||
| JP2015055524A | ||||
| JP201242384A | ||||
| JP2011232294A |
Foreign References:
| US20140374596 |
Attorney, Agent or Firm:
Hideyuki Sugiura