Title:
三次元構造体の貫通流路を研磨するための方法およびデバイス
Document Type and Number:
Japanese Patent JP6681584
Kind Code:
B2
Abstract:
Provided is a method for polishing a through flow passage with which it is possible to polish a through flow passage in a three-dimensional structure more appropriately without using a cylinder. In this method, a through flow passage is subjected to a polishing treatment by causing a polishing fluid including abrasive particles and a liquid to flow through the through flow passage. Particularly, the polishing fluid is extracted from a bottom part of a sealed container loaded with the polishing fluid, and is sent to the through flow passage.
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Inventors:
Shinya Watanabe
Satoshi Abe
Kenichi Tanaka
Uchinono Yoshiyuki
Mikio Mori
Kento Ohara
Morimoto Masanori
Satoshi Nakamura
Satoshi Abe
Kenichi Tanaka
Uchinono Yoshiyuki
Mikio Mori
Kento Ohara
Morimoto Masanori
Satoshi Nakamura
Application Number:
JP2016103327A
Publication Date:
April 15, 2020
Filing Date:
May 24, 2016
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
B24B31/00; B29C67/00; B33Y10/00; B33Y80/00
Domestic Patent References:
| JP2005059115A | ||||
| JP5115713A | ||||
| JP2002224958A | ||||
| JP200566731A | ||||
| JP2004114241A | ||||
| JP2011101937A | ||||
| JP56062717U | ||||
| JP2011067902A |
Attorney, Agent or Firm:
Samejima Mutsumi
Haruhiko Ema
Haruhiko Ema