Title:
検出チップの製造方法
Document Type and Number:
Japanese Patent JP6683126
Kind Code:
B2
Abstract:
A seal member having one or more through-holes and formed from an elastic body is pressed against a metal film such that the following expression (1) and expression (2) are satisfied. Then, liquid containing a capturing body is provided to the through-hole, and the capturing body is immobilized on the metal film. 0.15≤A1/A2≤6.5 … (1) 0.05≤ΔT/T≤0.25 … (2) [where A1 is an area (mm2) where the metal film and the seal member are brought into contact with each other, A2 is an opening area (mm2) of the through-hole having the smallest opening area on the metal film side, T is the thickness (mm) in a pressing direction of the metal film, and ΔT is the change amount (mm) of the thickness (T) in the pressing direction of the metal film, which is caused by pressing the seal member against the metal film.]
Inventors:
Hiroshi Umezu
Yoshihiro Okumura
Yoshihiro Okumura
Application Number:
JP2016525175A
Publication Date:
April 15, 2020
Filing Date:
June 02, 2015
Export Citation:
Assignee:
Konica Minolta Co., Ltd.
International Classes:
G01N21/41; G01N21/64
Domestic Patent References:
| JP2007256103A | ||||
| JP2006189397A | ||||
| JP2001249073A | ||||
| JP2002530643A |
Foreign References:
| US20100248283 |
Attorney, Agent or Firm:
Washeda International Patent Office
Takashi Kiso
Takashi Kiso