Title:
レーザ部品およびその製造方法
Document Type and Number:
Japanese Patent JP6689363
Kind Code:
B2
Abstract:
A laser component includes a housing that includes a base section including a top side and an underside, wherein a plurality of electrical soldering contact pads are configured at the underside of the base section, the electrical soldering contact pads enabling surface mounting of the laser component, a plurality of electrical chip contact pads are configured at the top side of the base section and electrically conductively connect to the soldering contact pads, the housing includes a cavity adjoining the top side of the base section, and a laser chip is arranged in the cavity and electrically conductively connects to at least some of the chip contact pads.
Inventors:
Woic Andreas
Osarte Martin
Osarte Martin
Application Number:
JP2018506421A
Publication Date:
April 28, 2020
Filing Date:
August 23, 2016
Export Citation:
Assignee:
Osram Opto Semiconductors GmbH
International Classes:
H01S5/0232
Domestic Patent References:
| JP2012054527A | ||||
| JP2009289775A | ||||
| JP2011517125A | ||||
| JP2002031747A | ||||
| JP2014531132A | ||||
| JP2015510277A |
Foreign References:
| CN104733999A | ||||
| WO2014154662A1 |
Attorney, Agent or Firm:
Washeda International Patent Office