Title:
シール基板アセンブリを使用する現場装置
Document Type and Number:
Japanese Patent JP6691109
Kind Code:
B2
Abstract:
A seal board includes a circuit board with vias, conductor pins, and solder joints. The solder joints connect and seal each conductor pin to a single via, such that each conductor pin extends through the via and extends from a first side of the circuit board and a second side of the circuit board. The seal board is mounted to cover an opening in a bulkhead that separates a first compartment (such as a terminal block compartment) from a second compartment (such as an electronics or feature board compartment). The seal board provides electrical paths between the compartments while protecting components within one of the compartments from the surrounding environment.
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Inventors:
Erichsen, Christopher
Bath, Michael
Bath, Michael
Application Number:
JP2017514513A
Publication Date:
April 28, 2020
Filing Date:
September 30, 2015
Export Citation:
Assignee:
Rosemount Incorporated
International Classes:
H05K1/11; G01L19/14; H05K1/02; H05K5/02; H05K7/14; H05K9/00
Domestic Patent References:
| JP2000513803A | ||||
| JP8236195A | ||||
| JP200788204A |
Attorney, Agent or Firm:
Nobuyuki Okajima