Title:
吸着確認方法、離脱確認方法、及び減圧処理装置
Document Type and Number:
Japanese Patent JP6697346
Kind Code:
B2
Abstract:
Disclosed herein is a hold checking method for checking whether or not a wafer is held by an electrostatic chuck in loading the wafer to the electrostatic chuck by operating a transfer unit holding the wafer. The hold checking method includes a connecting step of bringing the wafer held by a transfer pad into contact with the electrostatic chuck to thereby connect the transfer pad through the wafer to the electrostatic chuck, and a hold determining step of supplying electric power from a DC power source through first wiring to the electrostatic chuck after performing the connecting step, and next determining that the wafer is held by the electrostatic chuck when the voltage across a resistor inserted in the first wiring has reached a predetermined voltage value.
Inventors:
Kenta Chito
Application Number:
JP2016142216A
Publication Date:
May 20, 2020
Filing Date:
July 20, 2016
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/677; B65G49/07; H01L21/683; H02N13/00
Domestic Patent References:
| JP6224286A | ||||
| JP3211753A | ||||
| JP2007281007A | ||||
| JP63139634A | ||||
| JP1167884A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office