Title:
パターン製造方法、半導体装置の製造方法および積層体
Document Type and Number:
Japanese Patent JP6704047
Kind Code:
B2
Abstract:
A pattern production method which makes it possible to directly peel the transparent substrate from a laminate comprising a transparent substrate and a resin pattern (for example, an insulation layer) positioned on the surface of the transparent substrate; a semiconductor device production method; and a laminate are provided. This pattern production method involves a peeling step for peeling a transparent substrate from a laminate by irradiating the transparent substrate side of the laminate, which comprises a transparent substrate and a resin pattern positioned on the surface of the transparent substrate, wherein the resin pattern contains at least one type selected from polyimide and polybenzoxazole, and the absorbance of the resin pattern in the wavelength of the irradiation is greater than or equal to 0.5.
Inventors:
Takano Inujima
Mitsuru Sawano
Yoshinori Maehara
Mitsuru Sawano
Yoshinori Maehara
Application Number:
JP2018520957A
Publication Date:
June 03, 2020
Filing Date:
May 31, 2017
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/027; G03F7/20; G03F7/40; G03F7/42
Domestic Patent References:
| JP2003231752A | ||||
| JP1159613A | ||||
| JP2012069734A | ||||
| JP2009043962A | ||||
| JP7170072A | ||||
| JP8255980A | ||||
| JP2013042052A |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes