Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ポリアミドイミド用の低毒性溶媒系およびポリアミドアミック酸樹脂コーティング
Document Type and Number:
Japanese Patent JP6704352
Kind Code:
B2
Abstract:
A polyamideimide and polyamide amic acid resin polymer that allows for reduced levels of toxicity in manufacturing. In an embodiment, a coating composition comprises at least one polyamideimide resin, at least one aprotic dialkylamide solvent and at least one co-solvent. In another embodiment, the at least one co-solvent is selected from a group consisting of methyl acetate, n-propyl acetate, t-butyl acetate, iso-butyl acetate, ethyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, t-butyl lactate, cyclohexanone, cyclopentanone, n-butyl acetate, methyl alcohol, ethyl alcohol, isopropyl alcohol, n-acetyl morpholine, ε-caprolactone and methylcyclohexane.

Inventors:
Carissa M. Kelly
David E Noga
John E. Siddenstick
Limore Ben Asher
Atsushi Kondo
Application Number:
JP2016562750A
Publication Date:
June 03, 2020
Filing Date:
April 16, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Cymer-Dayton LRC
International Classes:
C09D179/08; C09D7/20
Domestic Patent References:
JP2012241082A
JP2013052604A
JP2015511935A
JP2013209499A
JP2012062355A
JP2017511423A
JP3181511A
JP2014062237A
JP59202259A
Foreign References:
WO2013090933A1
WO2013107822A1
US20120065296
WO2012144563A1
Attorney, Agent or Firm:
Junji Yuda
Noriyuki Takebayashi