Title:
半導体製造装置
Document Type and Number:
Japanese Patent JP6710178
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device which suppresses a size of an installation space.SOLUTION: A semiconductor manufacturing device 100 includes: a housing Ch1 which houses a semiconductor processing mechanism unit 20; and a cylindrical cover unit 30. The cover unit 30 is provided on the housing Ch1 so that an opening h3a of the cover unit 30 is connected to an opening H1 of the housing Ch1.SELECTED DRAWING: Figure 1
Inventors:
Katsuya Kubota
Application Number:
JP2017087919A
Publication Date:
June 17, 2020
Filing Date:
April 27, 2017
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L21/02; F24F7/06
Domestic Patent References:
| JP2016157802A | ||||
| JP2014236081A | ||||
| JP2001263748A | ||||
| JP2002313690A | ||||
| JP2006286682A |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita