Title:
粘着テープ、放熱シート及び電子機器
Document Type and Number:
Japanese Patent JP6711388
Kind Code:
B2
Abstract:
[Problem] To provide a thin pressure-sensitive adhesive tape which allows air bubbles to quickly escape from the interface with an adherend so as to suppress remaining of air bubbles at the interface, has a high adhesiveness and causes no worsening in appearance even in the case where the adherend has a thin thickness. [Solution] A pressure-sensitive adhesive tape which is provided with two or more pressure-sensitive adhesive parts in at least one surface side of a support and has a total thickness of 20 μm or less, characterized in that: the thickness of the pressure-sensitive adhesive parts is within the range of 1-15 μm; the area of each pressure-sensitive adhesive part is 0.02-0.5 mm2; and the distance between an arbitrary pressure-sensitive adhesive part and the nearest pressure-sensitive adhesive part is within the range of 0.03-0.2 mm.
Inventors:
Katsuaki Imai
Akira Yamagami
Akira Yamagami
Application Number:
JP2018202822A
Publication Date:
June 17, 2020
Filing Date:
October 29, 2018
Export Citation:
Assignee:
DIC Corporation
International Classes:
C09J7/38; B32B7/14; B32B9/00; B32B27/00; C09J7/20; C09J201/00; H05K7/20
Domestic Patent References:
| JP2010174148A | ||||
| JP9506564A | ||||
| JP3018714U | ||||
| JP2011042773A | ||||
| JP2007154144A | ||||
| JP2001110965A | ||||
| JP2005272763A | ||||
| JP2002319653A | ||||
| JP2010254979A | ||||
| JP2011216671A |
Foreign References:
| WO2016163537A1 | ||||
| WO2016111208A1 | ||||
| WO2017022749A1 |
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Yoshihiro Nagare
Naoko Matsuda
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno