Title:
発光素子及びこれを含む発光素子パッケージ
Document Type and Number:
Japanese Patent JP6712474
Kind Code:
B2
Abstract:
Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a substrate, a light emitting structure disposed under the substrate and including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, a first insulating layer configured to expose the second conductive semiconductor layer and disposed on a lower edge of the light emitting structure, a first light permeable electrode layer disposed under the second conductive semiconductor layer exposed by the first insulating layer, a second light permeable electrode layer disposed under the first insulating layer and the first light permeable electrode layer, and a reflective layer disposed under the second light permeable electrode layer.
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Inventors:
Seo, Jewon
Lee, Sanyoru
Junho, Seungho
Choi, Jin Kyung
Lee, Sanyoru
Junho, Seungho
Choi, Jin Kyung
Application Number:
JP2016050976A
Publication Date:
June 24, 2020
Filing Date:
March 15, 2016
Export Citation:
Assignee:
LG Innotek Co., Ltd
International Classes:
H01L33/10; H01L33/42
Domestic Patent References:
| JP2014135490A | ||||
| JP2015043462A |
Attorney, Agent or Firm:
Makoto Ono
Kenkyo Kanayama
Kazuki Shigemori
Hidehiko Ichikawa
Yoshikazu Iwase
Kenkyo Kanayama
Kazuki Shigemori
Hidehiko Ichikawa
Yoshikazu Iwase