Title:
電子部品装着機
Document Type and Number:
Japanese Patent JP6715591
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a technique of shortening a time of mounting an electronic component mounting machine.SOLUTION: An electronic component mounting machine 10 mounts an electronic component to a circuit board 2. The electronic component mounting machine 10 comprises a mounting stage 102, a suction nozzle 26 and a head 24. The mounting stage 102 mounts a plate 106 including a plurality of electronic components. The suction nozzle 26 sucks an upper surface of the electronic component. The head 24 supports the suction nozzle 26. The head 24 moves the suction nozzle 26 between the plate 106 mounted on the mounting stage 102 and the circuit board 2. The mounting stage 102 allows the plate 106 to rotate, and can change a distance of the electronic component and the circuit board 2.SELECTED DRAWING: Figure 2
Inventors:
Kumazawa Hideyuki
Application Number:
JP2015222411A
Publication Date:
July 01, 2020
Filing Date:
November 12, 2015
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K13/04; H05K13/02
Domestic Patent References:
| JP2010056442A | ||||
| JP2012175037A | ||||
| JP2010177486A | ||||
| JP2006135013A | ||||
| JP2002093826A |
Attorney, Agent or Firm:
Kaiyu International Patent Office