Title:
導電性布帛
Document Type and Number:
Japanese Patent JP6721338
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive fabric excellent in flexibility, small in change rate of resistance to elongation and maintaining high conductivity long as a conductive pattern is hardly fractured by elongation of fabric.SOLUTION: There is provided a conductive fabric having a conductive pattern 3 formed on a fabric 5 by a conductive material and having arithmetic average roughness Ra of a surface of the conductive pattern 3 measured according to JIS B 0601 of 5.0 to 20.0 μm. There is provided a conductive fabric where a protective layer 2 may be laminated on the surface of the conductive pattern 3. There is provided a conductive fabric where the conductive material is preferably a conductive resin composition containing one or more conductive particles selected from a silver particle, a silver/silver chloride particle or carbon particle and one or more kind of binder resin selected from a polyurethane resin, an acrylic resin, a polyester resin or an epoxy resin and a synthetic resin forming the protective layer 2 is preferably a polyurethane resin or a phenoxy resin.SELECTED DRAWING: Figure 1
Inventors:
Hiroyuki Hayashi
Application Number:
JP2016003330A
Publication Date:
July 15, 2020
Filing Date:
January 12, 2016
Export Citation:
Assignee:
SEIREN CO.,LTD.
International Classes:
B32B5/02; B32B27/18
Domestic Patent References:
| JP62076506A | ||||
| JP2005539150A | ||||
| JP2015003442A | ||||
| JP2000315846A | ||||
| JP2004017456A | ||||
| JP2000340908A | ||||
| JP7216765A |
Foreign References:
| US20040053552 | ||||
| WO2016114339A1 |
Other References:
井上ら,E-テキスタイル実装への印刷工法の適用,表面技術,日本,2013年,Vol.64,No11,577-581