Title:
接着剤、積層体、積層体の製造方法および電子部品
Document Type and Number:
Japanese Patent JP6724620
Kind Code:
B2
Abstract:
SOLUTION: An adhesive contains aromatic secondary amine (A) having at least two groups represented by formula (1) and an epoxy resin (C). In formula (1), Ar represents an aryl group having 6 to 30 carbon atoms which may have a substituent group, and * represents a bond.EFFECT: An adhesive can satisfactorily suppress occurrence of a gap of an adhesive layer in bonding of a semiconductor element. When semiconductor elements having a solder bump formed by IMS method are laminated using the adhesive, occurrence of a gap in an adhesive layer is less, and a bond strength between the semiconductor elements is strong.SELECTED DRAWING: None
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Inventors:
Ryoji Tada
Yamashita Yutoku
Tomohiro Obata
Kenzo Okita
Koichi Hasegawa
Yamashita Yutoku
Tomohiro Obata
Kenzo Okita
Koichi Hasegawa
Application Number:
JP2016141421A
Publication Date:
July 15, 2020
Filing Date:
July 19, 2016
Export Citation:
Assignee:
JSR CORPORATION
International Classes:
H01L21/60; C09J11/04; C09J11/06; C09J163/00
Domestic Patent References:
| JP2004885A | ||||
| JP61081423A | ||||
| JP61089219A | ||||
| JP6017025A | ||||
| JP2004091734A | ||||
| JP2008169241A | ||||
| JP2011236381A | ||||
| JP5202348A |
Foreign References:
| US6951907 |
Attorney, Agent or Firm:
Patent corporation ssinpat