Title:
機器温調装置
Document Type and Number:
Japanese Patent JP6724888
Kind Code:
B2
Abstract:
A device heat exchanger is capable of exchanging heat between a target device and a working fluid. A condenser may be disposed above the device heat exchanger in the gravitational direction, a gas phase passage communicates the condenser with an upper connection portion of the device heat exchanger, and a liquid phase passage communicates the condenser with a lower connection portion of the device heat exchanger. A fluid passage communicates the upper connection portion of the device heat exchanger with the lower connection portion of the device heat exchanger, without including the condenser on a route of the fluid passage. A heating portion is capable of heating the liquid-phase working fluid flowing through the fluid passage, and a controller operates the heating portion when heating the target device and stops an operation of the heating portion when cooling the target device.
Inventors:
Masayuki Takeuchi
Yasumitsu Omi
Takeshi Yoshinori
Miura Koji
Yasumitsu Omi
Takeshi Yoshinori
Miura Koji
Application Number:
JP2017235120A
Publication Date:
July 15, 2020
Filing Date:
December 07, 2017
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01M10/633; B60K1/04; F25B1/00; H01M10/613; H01M10/615; H01M10/617; H01M10/625; H01M10/6568; H01M10/6569; H01M10/663
Domestic Patent References:
| JP9138030A | ||||
| JP2015041418A | ||||
| JP4287710A | ||||
| JP2005249258A | ||||
| JP2004085151A |
Attorney, Agent or Firm:
Patent Business Corporation Yuai Patent Office