Title:
コイル部品及び電子機器
Document Type and Number:
Japanese Patent JP6730397
Kind Code:
B2
Abstract:
A coil component includes: a first substrate body and a second substrate body, both formed in a manner containing a magnetic material; an adhesive containing an organic material and a filler, for bonding the first substrate body and the second substrate body; a coil formed by a conductor having an insulating film; and electrodes connected electrically to the coil; wherein the surface roughness of the face of the first substrate body bonded to the second substrate body via the adhesive is higher than the average grain size of the filler.
Inventors:
Katsuyuki Horie
Application Number:
JP2018185572A
Publication Date:
July 29, 2020
Filing Date:
September 28, 2018
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H01F17/04; H01F27/24; H01F27/26; H01F41/02
Domestic Patent References:
| JP4105520U | ||||
| JP2009259991A | ||||
| JP2017005079A | ||||
| JP2015032643A | ||||
| JP2014090158A | ||||
| JP2010135758A |
Foreign References:
| WO2011027559A1 |
Attorney, Agent or Firm:
Shuhei Katayama