Title:
パラジウム無電解めっき用のめっき浴組成物およびパラジウムの無電解めっき方法
Document Type and Number:
Japanese Patent JP6732751
Kind Code:
B2
Abstract:
The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aromatic compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aromatic compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aromatic compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths.
Inventors:
Andreas Walter
Katharina Muskruth
Katharina Muskruth
Application Number:
JP2017532969A
Publication Date:
July 29, 2020
Filing Date:
December 17, 2015
Export Citation:
Assignee:
Atotech Deutschland GmbH
International Classes:
C23C18/44
Domestic Patent References:
| JP2003268558A | ||||
| JP10511738A | ||||
| JP2014528518A | ||||
| JP7062549A | ||||
| JP2013227641A | ||||
| JP5214551A |
Foreign References:
| US20140242265 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Ohta Kengaku
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Ohta Kengaku
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima