Title:
研削装置
Document Type and Number:
Japanese Patent JP6734670
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a grinding device that can reduce loads of a motor while preventing occurrence of backlash in grinding a wafer using the device.SOLUTION: The grinding device comprises grinding means 7 and means 5 for grinding/feeding the grinding means 7. The grind/feeding means 5 comprises: a ball screw 50; a rail 51 which guides the grinding means 7; a motor 52 which rotates the ball screw 50; a counter balance 59 which lifts up the grinding means 7; and a counter balance adjustment means 58. The adjustment means 58 adjusts the counter balance 59 when the grinding means 7 is fed in a descending direction, applies force for lifting up the grinding means 7 from the counter balance 59 to the grinding means 7 until a grinding grindstone 740 contacts a wafer, contacts a lower surface of a screw groove of the ball screw 50 with an upper surface of a screw groove of a nut 750 so as to eliminate backlash, and adjusts the counter balance 59 after the grinding grindstone 740 contacts the wafer, so as to weaken the force for lifting up the grinding means 7 to reduce loads of the motor 52.SELECTED DRAWING: Figure 1
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Inventors:
Current Ojiro Jiro
Hideki Koshimizu
Masashi Hamabuchi
Big wave go
Hideki Koshimizu
Masashi Hamabuchi
Big wave go
Application Number:
JP2016050902A
Publication Date:
August 05, 2020
Filing Date:
March 15, 2016
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B47/28; B23Q1/72; B24B7/04; B24B47/12; B24B47/20; B24B47/26; H01L21/304
Domestic Patent References:
| JP2014104562A | ||||
| JP2006303161A | ||||
| JP2012056007A |
Foreign References:
| WO1990006834A1 |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office