Title:
電子部品収納用枠体およびその製造方法
Document Type and Number:
Japanese Patent JP6743338
Kind Code:
B2
Abstract:
To provide a wall surface portion of a versatile inexpensive electronic component storage container (storage box) which enables mass production.SOLUTION: The frame for housing an electronic component constitutes a wall surface portion of an electronic component storage container for accommodating a light emitting element or a light receiving element and an electronic component used in a light emitting and light receiving device of an optical semiconductor. The frame 10 is formed of a workpiece formed into a rectangular pipe shape using a rectangular nickel alloy having low expansion property, low thermal conductivity, and process hardening property by impact press processing.SELECTED DRAWING: Figure 1
Inventors:
Takakuni
Application Number:
JP2017099245A
Publication Date:
August 19, 2020
Filing Date:
May 18, 2017
Export Citation:
Assignee:
Micro Cut Co., Ltd.
International Classes:
H01L23/02; G02B6/42; H01L23/06; H01L31/02
Domestic Patent References:
| JP2010080562A | ||||
| JP2014194912A | ||||
| JP2002239648A | ||||
| JP2008112726A | ||||
| JP2009037920A | ||||
| JP3114365U |
Foreign References:
| WO2014083992A1 |
Attorney, Agent or Firm:
Satoshi Iwata