Title:
感光性樹脂組成物、感光性樹脂積層体、レジストパターン形成方法及び導体パターン製造方法
Document Type and Number:
Japanese Patent JP6755109
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition that exhibits excellent resolution and removability and high viscosity stability of a prepared liquid of the photosensitive resin composition prior to being formed into a dry film, and that is developable with an alkaline aqueous solution.SOLUTION: The photosensitive resin composition comprises (a) an alkali-soluble polymer containing a carboxyl group by 20 to 80 mass%, (b) an ethylenically unsaturated addition polymerizable monomer by 5 to 60 mass%, (c) a photopolymerization initiator by 0.1 to 20 mass%, (d) a p-toluene sulfonic acid amide by 0.5 to 8 mass%, and (e) an alkylene oxide compound represented by general formula (I) by 0.05 to 1.0 mass%. In formula (I), X, Y, R, R, R, n, m, k and l are defined by the specification of the present invention.SELECTED DRAWING: None
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Inventors:
Hideaki Nishimoto
Application Number:
JP2016065796A
Publication Date:
September 16, 2020
Filing Date:
March 29, 2016
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
G03F7/004; C08F2/50; G03F7/027; G03F7/032; G03F7/16; H05K3/06; H05K3/18
Domestic Patent References:
| JP2007226158A |
Foreign References:
| WO2015178462A1 | ||||
| WO2015099137A1 | ||||
| US4885229 |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima
Shinji Mitsuhashi
Kazuhiro Nakamura
Toko Saito
Shunsuke Mima