Title:
被処理体を処理する方法
Document Type and Number:
Japanese Patent JP6757624
Kind Code:
B2
Abstract:
A method of processing a target object is provided. The target object has an etching target layer, an organic film on the etching target layer and a mask on the organic film. The organic film includes a first layer and a second layer, the mask is provided on the first layer, the first layer is provided on the second layer, and the second layer is provided on the etching target layer. The method includes generating plasma of a first gas within a processing vessel of a plasma processing apparatus in which the target object is accommodated; etching the first layer with the plasma of the first gas and the mask until the second layer is exposed; and conformally forming a protection film on a side surface of the first layer; and generating plasma of a second gas and removing the mask with the plasma of the second gas.
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Inventors:
Shinya Morikita
Takanori Banse
Yuta Seya
Ryosuke Niizuma
Takanori Banse
Yuta Seya
Ryosuke Niizuma
Application Number:
JP2016158659A
Publication Date:
September 23, 2020
Filing Date:
August 12, 2016
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/3065; H05H1/46
Domestic Patent References:
| JP2013161913A | ||||
| JP2016021546A | ||||
| JP2016076620A | ||||
| JP2008078617A | ||||
| JP2009152243A | ||||
| JP2016143698A | ||||
| JP2011216817A | ||||
| JP2015050358A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Yoshiki Kuroki
Junji Kashiwaoka