Title:
対基板作業機、および挿入方法
Document Type and Number:
Japanese Patent JP6759348
Kind Code:
B2
Abstract:
Leads 144 of leaded component 140 held by suction nozzle 66 are inserted into through-holes 148 formed in circuit board 12. Then, molten solder 150 is applied to the leads of the leaded component being held by the suction nozzle. Thus, positional deviation of the leaded component during application of the molten solder to the leads is prevented. Also, the leaded component continues to be held by the suction nozzle after application of molten solder to the leads has been completed. Thus, positional deviation of the leaded component while the molten solder hardens is prevented. In this manner, by holding leaded component 140 with a suction nozzle while applying molten solder to leads and while the molten solder is hardening, positional deviation of the leaded component is prevented and the leaded component is mounted with high accuracy.
Inventors:
Noriaki Iwaki
Application Number:
JP2018541854A
Publication Date:
September 23, 2020
Filing Date:
September 30, 2016
Export Citation:
Assignee:
Fuji corporation
International Classes:
H05K3/34; B23K1/08; H05K13/04
Domestic Patent References:
| JP2014130948A | ||||
| JP2011254034A | ||||
| JP200351671A | ||||
| JP10209622A |
Foreign References:
| WO2014045370A1 |
Attorney, Agent or Firm:
Patent business corporation NEXT
Yasutaka Fukatsu
Yuki Kataoka
Yasutaka Fukatsu
Yuki Kataoka