Title:
はんだ付け装置
Document Type and Number:
Japanese Patent JP6759350
Kind Code:
B2
Abstract:
In this soldering device, a second temperature sensor 162 is arranged outside a jetting device 100. Further, the jetting device is moved in such a way that the second temperature sensor comes into contact with molten solder being jetted from a jet nozzle 118, and the temperature of the molten solder being jetted from the jet nozzle is measured. By this means it is possible for an arrangement space for the temperature sensor to be easily secured. Further, the extent of degradation of the temperature sensor resulting from high-temperature molten solder is much lower than with a temperature sensor that is arranged inside the jet nozzle and is constantly immersed in high-temperature molten solder. It is thus possible to adopt a temperature sensor including a measuring portion having a small wire diameter, and it is possible for the temperature to be measured with satisfactory sensing. Further, the frequency with which the temperature sensor is replaced can also be reduced.
Inventors:
Kazuya Izura
Satoru Otsubo
Satoru Otsubo
Application Number:
JP2018543540A
Publication Date:
September 23, 2020
Filing Date:
October 06, 2016
Export Citation:
Assignee:
Fuji corporation
International Classes:
B23K1/08; G01K1/14; H05K3/34
Domestic Patent References:
| JP2000005868A | ||||
| JP11123540A |
Foreign References:
| WO2013168198A1 |
Attorney, Agent or Firm:
Patent business corporation NEXT
Yasutaka Fukatsu
Yuki Kataoka
Yasutaka Fukatsu
Yuki Kataoka