Title:
スクラッチ検出方法
Document Type and Number:
Japanese Patent JP6760820
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To detect scratch appropriately by distinguishing a split line and a scratch.SOLUTION: A scratch detection method has a processing groove formation process for forming a split groove (V) in the surface of a wafer (W), a grinding process for exposing the processing groove by grinding the wafer from the back side, an imaging process for imaging the ground surface of the wafer after grinding, an edition step for editing the captured image of the wafer to a strip image by performing coordinate transformation, a removal process for removing the line corresponding to the split line from the strip image, and a determination process for determining presence of the scratch based on the strip image after removal.SELECTED DRAWING: Figure 4
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Inventors:
Shinji Yoshida
Application Number:
JP2016214399A
Publication Date:
September 23, 2020
Filing Date:
November 01, 2016
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/301; B24B7/04; B24B49/12; H01L21/304; H01L21/66
Domestic Patent References:
| JP2010030007A | ||||
| JP2016049581A | ||||
| JP2010182753A | ||||
| JP201675554A |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Amada Masayuki