Title:
半導体装置及びその製造方法、並びに自動車
Document Type and Number:
Japanese Patent JP6765548
Kind Code:
B2
Abstract:
In the semiconductor device, a screw has a head section embedded in a case groove section provided in a frame placing stage of a case to cause side and front surfaces of the head section to be covered by the case, thereby fixing the screw to the case. A threaded section passes through a frame through hole of a frame exposed section disposed above the head section to protrude upward to be exposed on a side facing away from the base plate.
Inventors:
Yousuke Nakata
Application Number:
JP2019550071A
Publication Date:
October 07, 2020
Filing Date:
November 01, 2017
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| JP2011077463A | ||||
| JP2016018866A | ||||
| JP2012138531A | ||||
| JP2017011305A | ||||
| JP2015053301A |
Foreign References:
| US20140376184 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita