Title:
ポリアミド酸、ポリイミド、樹脂フィルム及び金属張積層板
Document Type and Number:
Japanese Patent JP6767751
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide polyimide which can cope with high frequency in association with miniaturization/higher performance of an electronic apparatus and has a low coefficient of thermal expansion; a resin film; and a metal-clad laminate.SOLUTION: There are provided polyimide acid which is a polyamide acid obtained by reaction of a diamine component and an acid anhydride component containing a tetracarboxylic acid anhydride, where the diamine component contains a diamine compound represented by formula (i) in a range of 5-100 mol% with respect to the total diamine component; and polyimide obtained by imidization of the same. In formula (i), Rto Rare each independently H, an alkyl group or an alkoxy group.SELECTED DRAWING: None
Inventors:
Yasuhiro Adachi
Application Number:
JP2016029113A
Publication Date:
October 14, 2020
Filing Date:
February 18, 2016
Export Citation:
Assignee:
Nippon Steel Chemical & Material Co., Ltd.
International Classes:
C08G73/10; B32B7/027; B32B15/088; B32B27/34; H05K1/03
Domestic Patent References:
| JP4007333A | ||||
| JP2005504852A |
Attorney, Agent or Firm:
Kazuhiro Watanabe