Title:
半導体装置、リレーシステム、テストシステム及びリレーの駆動方法
Document Type and Number:
Japanese Patent JP6778122
Kind Code:
B2
Abstract:
PURPOSE: To provide a semiconductor device, a testing system, and a method of driving a relay capable of driving a plurality of relays without causing increase in device scale.CONSTITUTION: A semiconductor device comprises: a control terminal that receives a relay control signal; a voltage application part that applies to first to n-th (n is an integer equal to or more than two) nodes first to n-th voltages obtained by stepping down a voltage value represented by the relay control signal by voltage values different from each other; a voltage restriction part that maintains a voltage of a node whose voltage applied by the voltage application part becomes equal to or more than a predetermined voltage value, among the first to n-th nodes, to a predetermined voltage value; and first to n-th drive terminals for outputting the voltages of the first to n-th nodes as first to n-th drive signals.SELECTED DRAWING: Figure 1
Inventors:
Companion Masashi
Application Number:
JP2017012452A
Publication Date:
October 28, 2020
Filing Date:
January 26, 2017
Export Citation:
Assignee:
LAPIS Semiconductor Co., Ltd.
International Classes:
H01H47/32; G01R31/28; H01H9/54; H01H47/00
Domestic Patent References:
| JP49039355U | ||||
| JP2004362992A |
Attorney, Agent or Firm:
Motohiko Fujimura
Shinji Takano
Shinji Takano