Title:
半導体装置用のプローブ針
Document Type and Number:
Japanese Patent JP6778937
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a probe needle for a semiconductor device having high durability and also giving good use feeling such as easiness of needle contact and provide a probe for a semiconductor device having good electrical characteristics.SOLUTION: A probe needle for a semiconductor device includes a tip. The tip has a contact portion, a base portion, and a middle portion positioned between the contact portion and the base portion. The contact portion has an almost conical shape and includes opposing first inclined plane portions with a long axis of the probe needle as a reference. An edge angle of the contact portion is 30° or greater and 110° or less. The edge angle is preferably 45° or greater and 90° or less.SELECTED DRAWING: Figure 1
Inventors:
Yuko Akabane
Tetsuro Endo
Muraguchi Masakazu
Tetsuro Endo
Muraguchi Masakazu
Application Number:
JP2017082963A
Publication Date:
November 04, 2020
Filing Date:
April 19, 2017
Export Citation:
Assignee:
TDC Corporation
Tohoku University
Tohoku University
International Classes:
G01R1/067; G01R31/26; H01L21/66
Domestic Patent References:
| JP2009270836A | ||||
| JP2008039639A | ||||
| JP2007114040A | ||||
| JP2004093355A |
Attorney, Agent or Firm:
Eichi International Patent Office