Title:
キャリア箔付銅箔及び銅張積層板
Document Type and Number:
Japanese Patent JP6784806
Kind Code:
B2
Abstract:
In order to provide a copper foil having an attached carrier foil, whereby the carrier foil can be easily peeled off a copper foil layer even when used during copper-clad laminate production using temperatures of at least 250°C, a copper foil having an attached carrier foil is provided that comprises a layer structure including a carrier foil, a bonded interface layer, and a copper foil layer. The copper foil having the attached carrier foil is characterized by using as the carrier foil an electrolytic copper foil that, after heat treatment for 60 minutes at 250°C, has a tensile strength of at least 40 kgf/mm2.
Inventors:
Tetsuhiro Matsunaga
Mitsuyoshi Matsuda
Tetsu Satoshi Takanashi
Nobuyuki Kawai
Mitsuyoshi Matsuda
Tetsu Satoshi Takanashi
Nobuyuki Kawai
Application Number:
JP2019123171A
Publication Date:
November 11, 2020
Filing Date:
July 01, 2019
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C25D1/22; B32B7/022; B32B15/04; B32B15/20; C25D1/04; H05K1/09
Domestic Patent References:
| JP2008255462A | ||||
| JP2009221592A | ||||
| JP2010222657A | ||||
| JP2001062955A | ||||
| JP2005307270A | ||||
| JP2007217791A | ||||
| JP2005288856A | ||||
| JP2007294923A |
Foreign References:
| WO2012002526A1 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura