Title:
実装装置
Document Type and Number:
Japanese Patent JP6787613
Kind Code:
B2
Abstract:
A mounting apparatus includes: a bonding stage; a base; a mounting head for performing a temporary press-attachment process in which semiconductor chips are suction-held and temporarily press-attached to a mounted object and a final press-attachment process in which the temporarily press-attached semiconductor chips are finally press-attached; a film arrangement mechanism arranged on the bonding stage or the base; and a controller which controls driving of the mounting head and the film arrangement mechanism. The film arrangement mechanism includes: a film feed-out mechanism which has a pair of feed rollers with a cover film extended there-between and successively feeds out a new cover film; and a film movement mechanism which moves the cover film in a horizontal direction with respect to a substrate.
Inventors:
Kohei Seyama
Tetsuya Utano
Tetsuya Utano
Application Number:
JP2019557260A
Publication Date:
November 18, 2020
Filing Date:
November 28, 2018
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/60
Domestic Patent References:
| JP2004165536A | ||||
| JP2017123423A | ||||
| JP2006286659A |
Foreign References:
| WO2013133015A1 | ||||
| WO2016125763A1 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office