Title:
基板処理装置
Document Type and Number:
Japanese Patent JP6789038
Kind Code:
B2
Abstract:
The controller of a substrate processing apparatus carries out a liquid column forming step in which cleaning liquid is discharged through a lower surface nozzle when a spin chuck is not holding a substrate, to form a liquid column extending upward from the lower surface nozzle, and, in parallel with the liquid column forming step, a first dropping portion cleaning step in which an upper surface nozzle is reciprocated horizontally between a first position where a dropping portion of the upper surface nozzle does not contact the liquid column and a second position where the dropping portion of the upper surface nozzle does not contact the liquid column, so as to cause the upper surface nozzle to pass through a first middle position where the upper discharge port of the upper surface nozzle overlaps with the liquid column in a plan view.
Inventors:
Atsushi Miura
Masahide Ikeda
Yuki Tsujikawa
Kazuhiro Fujita
Yuya Dobashi
Masahide Ikeda
Yuki Tsujikawa
Kazuhiro Fujita
Yuya Dobashi
Application Number:
JP2016166951A
Publication Date:
November 25, 2020
Filing Date:
August 29, 2016
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304
Domestic Patent References:
| JP2007123559A | ||||
| JP2013026369A | ||||
| JP2013201235A | ||||
| JP2000133626A | ||||
| JP2002158202A | ||||
| JP2002057138A |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office